J-Devices will be exhibiting at AUTOMOTIVE WORLD 2018.
Packaging and Technical Solution for Next Generation Automotive Systems
J-Devices and Amkor provide packaging and
to address the most demanding technical challenges facing
automotive IC manufacturing today.
- Date: Jan 17 wed - 19 fri, 2018
- Venue: Tokyo Big Sight, Japan
- Name of the Exhibition: CAR-ELE JAPAN in AUTOMOTIVE WORLD
- Booth No: E-37-4
To see the detail, please visit here.