NEWS

Development Engineer will be presenting at a work shop.

Development Engineer will be presenting at JIEP Work Shop in Japan.

 * JIEP: Japan Institute of Electronics Packaging

 
- Date:      October 26, 27, 2017

- Location: Laforet Shuzenji, 1529 Ohdaira, Izu, Shizuoka Prefecture 

- Presentation Title:   Advanced Embedded Packaging for Power Devices


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