NEWS

Development Engineer will be presenting at a symposium.

Development Engineer will be presenting at a symposium.

- Symposium :             Organic High-density Wiring Technology - FOWLP, PLP, Core-less Substrate

- Presentation Title:     The Development Trend of Semiconductor Package with RDL

- Date :                        13:00-17:00 August 28, 2017

- Location :                  Royal Blue Hall in Tokyo Tech Front at Tokyo Institute of  Technology, Ohkurayama-Campus

- Name of Presenter:  Fumihiko Taniguchi at Package Development Department


To see the detail, please visit URL below.